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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT OVAL TYPE LED LAMPS Pb Lead-Free Parts LURF32840/P1-PF DATA SHEET DOC. NO : REV. DATE : : QW0905-LURF32840/P1-PF A 01 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 1/5 Package Dimensions 3.9 3.1 6.3 9.80.5 1.5 MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Vertcal Axis 48 Horizontal Axis 84 0 -30 30 -60 60 100% 75% 50% 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 84 Degree/V 48 Degree LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 2/5 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol URF Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 50 130 120 10 2000 -40 ~ +85 -40 ~ +100 mA mA mW UNIT A V Static the Use of conductive wrist band or anti-electrosatic *glove isElectricity or power surge will damageLED.LED.devices, aequipment and machinery must be properly recommended when handing these All grounded. Typical Electrical & Optical Characteristics (Ta=25 ) Forward Dominant Spectral voltage wave halfwidth length nm @20mA(V) Luminous intensity @20mA(mcd) PART NO MATERIAL COLOR Dnm Viewing angle 2 1/2 (deg) Emitted Lens Min. Max. Min. Typ. Vertical Axis 48 LURF32840/P1-PF AlGaInP Red Red Diffused 630 20 1.5 2.4 300 450 Horizontal Axis 84 Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 3/5 Typical Electro-Optical Characteristics Curve URF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 100 1000 Forward Current(mA) Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0 10 1.0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25 Relative Intensity@20mA Normalize@25 -40 -20 -0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature() Ambient Temperature() Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) 260 C3sec Max 260 5 /sec max 120 2 /sec max Preheat 60 Seconds Max 25 0 0 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LURF32840/P1-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=1055 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-405 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=655 2.RH=90%~95% 3.t=240hrs2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=1055&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=2605 2.Dwell time= 101sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=2305 2.Dwell time=51sec This test intended to see soldering well performed or not. |
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